Packaging structure of photoelectric module and photoelectric module using packaging structure

The invention discloses a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, the packaging structure comprises a centrosymmetric substrate, one surface of the substrate is provided with a plurality of light emitting/receiving devices and a drive...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JIANG HUI, ZHOU YIHUAN, WANG XUMAO, WANG QUNZE
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator JIANG HUI
ZHOU YIHUAN
WANG XUMAO
WANG QUNZE
description The invention discloses a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, the packaging structure comprises a centrosymmetric substrate, one surface of the substrate is provided with a plurality of light emitting/receiving devices and a driver, and the other surface of the substrate is provided with a plurality of electrical contacts; the electrical contacts comprise a plurality of first contacts and a plurality of second contacts, the second contacts are arranged on the peripheries of the first contacts, intervals are arranged between the second contacts, and the surface area of the first contacts is larger than that of the second contacts. The photoelectric module can be suitable for different types of optical assemblies. According to the invention, the base is directly used for installing the light emitting/receiving device, and the assembly process is simple; a plurality of electrical contacts are arranged on the back surface of the substrate and a
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115166915A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115166915A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115166915A3</originalsourceid><addsrcrecordid>eNrjZIgLSEzOTkzPzEtXKC4pKk0uKS1KVchPUyjIyC_JT81JTS4pykxWyM1PKc1JVUjMS8EuUVoMMqAA0ygeBta0xJziVF4ozc2g6OYa4uyhm1qQH59aDNSRmpdaEu_sZ2hoamhmZmlo6mhMjBoAzrs9uw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Packaging structure of photoelectric module and photoelectric module using packaging structure</title><source>esp@cenet</source><creator>JIANG HUI ; ZHOU YIHUAN ; WANG XUMAO ; WANG QUNZE</creator><creatorcontrib>JIANG HUI ; ZHOU YIHUAN ; WANG XUMAO ; WANG QUNZE</creatorcontrib><description>The invention discloses a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, the packaging structure comprises a centrosymmetric substrate, one surface of the substrate is provided with a plurality of light emitting/receiving devices and a driver, and the other surface of the substrate is provided with a plurality of electrical contacts; the electrical contacts comprise a plurality of first contacts and a plurality of second contacts, the second contacts are arranged on the peripheries of the first contacts, intervals are arranged between the second contacts, and the surface area of the first contacts is larger than that of the second contacts. The photoelectric module can be suitable for different types of optical assemblies. According to the invention, the base is directly used for installing the light emitting/receiving device, and the assembly process is simple; a plurality of electrical contacts are arranged on the back surface of the substrate and a</description><language>chi ; eng</language><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221011&amp;DB=EPODOC&amp;CC=CN&amp;NR=115166915A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221011&amp;DB=EPODOC&amp;CC=CN&amp;NR=115166915A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIANG HUI</creatorcontrib><creatorcontrib>ZHOU YIHUAN</creatorcontrib><creatorcontrib>WANG XUMAO</creatorcontrib><creatorcontrib>WANG QUNZE</creatorcontrib><title>Packaging structure of photoelectric module and photoelectric module using packaging structure</title><description>The invention discloses a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, the packaging structure comprises a centrosymmetric substrate, one surface of the substrate is provided with a plurality of light emitting/receiving devices and a driver, and the other surface of the substrate is provided with a plurality of electrical contacts; the electrical contacts comprise a plurality of first contacts and a plurality of second contacts, the second contacts are arranged on the peripheries of the first contacts, intervals are arranged between the second contacts, and the surface area of the first contacts is larger than that of the second contacts. The photoelectric module can be suitable for different types of optical assemblies. According to the invention, the base is directly used for installing the light emitting/receiving device, and the assembly process is simple; a plurality of electrical contacts are arranged on the back surface of the substrate and a</description><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgLSEzOTkzPzEtXKC4pKk0uKS1KVchPUyjIyC_JT81JTS4pykxWyM1PKc1JVUjMS8EuUVoMMqAA0ygeBta0xJziVF4ozc2g6OYa4uyhm1qQH59aDNSRmpdaEu_sZ2hoamhmZmlo6mhMjBoAzrs9uw</recordid><startdate>20221011</startdate><enddate>20221011</enddate><creator>JIANG HUI</creator><creator>ZHOU YIHUAN</creator><creator>WANG XUMAO</creator><creator>WANG QUNZE</creator><scope>EVB</scope></search><sort><creationdate>20221011</creationdate><title>Packaging structure of photoelectric module and photoelectric module using packaging structure</title><author>JIANG HUI ; ZHOU YIHUAN ; WANG XUMAO ; WANG QUNZE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115166915A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>JIANG HUI</creatorcontrib><creatorcontrib>ZHOU YIHUAN</creatorcontrib><creatorcontrib>WANG XUMAO</creatorcontrib><creatorcontrib>WANG QUNZE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIANG HUI</au><au>ZHOU YIHUAN</au><au>WANG XUMAO</au><au>WANG QUNZE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaging structure of photoelectric module and photoelectric module using packaging structure</title><date>2022-10-11</date><risdate>2022</risdate><abstract>The invention discloses a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, the packaging structure comprises a centrosymmetric substrate, one surface of the substrate is provided with a plurality of light emitting/receiving devices and a driver, and the other surface of the substrate is provided with a plurality of electrical contacts; the electrical contacts comprise a plurality of first contacts and a plurality of second contacts, the second contacts are arranged on the peripheries of the first contacts, intervals are arranged between the second contacts, and the surface area of the first contacts is larger than that of the second contacts. The photoelectric module can be suitable for different types of optical assemblies. According to the invention, the base is directly used for installing the light emitting/receiving device, and the assembly process is simple; a plurality of electrical contacts are arranged on the back surface of the substrate and a</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN115166915A
source esp@cenet
subjects OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
title Packaging structure of photoelectric module and photoelectric module using packaging structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T04%3A35%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIANG%20HUI&rft.date=2022-10-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN115166915A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true