Packaging structure of photoelectric module and photoelectric module using packaging structure

The invention discloses a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, the packaging structure comprises a centrosymmetric substrate, one surface of the substrate is provided with a plurality of light emitting/receiving devices and a drive...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JIANG HUI, ZHOU YIHUAN, WANG XUMAO, WANG QUNZE
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, the packaging structure comprises a centrosymmetric substrate, one surface of the substrate is provided with a plurality of light emitting/receiving devices and a driver, and the other surface of the substrate is provided with a plurality of electrical contacts; the electrical contacts comprise a plurality of first contacts and a plurality of second contacts, the second contacts are arranged on the peripheries of the first contacts, intervals are arranged between the second contacts, and the surface area of the first contacts is larger than that of the second contacts. The photoelectric module can be suitable for different types of optical assemblies. According to the invention, the base is directly used for installing the light emitting/receiving device, and the assembly process is simple; a plurality of electrical contacts are arranged on the back surface of the substrate and a