Nondestructive testing method for temperature distribution uniformity of multiple chips in SiC MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) module

The invention discloses a nondestructive testing method for temperature distribution uniformity of multiple chips in a SiCMOSFET (silicon carbide metal oxide semiconductor field effect transistor) module, which comprises the following steps of: applying a high gate voltage to a gate of the SiCMOSFET...

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Bibliographische Detailangaben
Hauptverfasser: CUI SHAOXIONG, GUO CHUNSHENG, DING JUEWEN, ZHAO DI, LI YUMENG
Format: Patent
Sprache:chi ; eng
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