Automatic surface mounting equipment for electronic components

The invention provides electronic component automatic surface mounting equipment, which comprises an electronic component placing mechanism, the electronic component placing mechanism comprises a box body and a vacuum tube, the bottom of the box body is connected with an electronic component placing...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HUANG HAOZHEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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