Automatic surface mounting equipment for electronic components
The invention provides electronic component automatic surface mounting equipment, which comprises an electronic component placing mechanism, the electronic component placing mechanism comprises a box body and a vacuum tube, the bottom of the box body is connected with an electronic component placing...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides electronic component automatic surface mounting equipment, which comprises an electronic component placing mechanism, the electronic component placing mechanism comprises a box body and a vacuum tube, the bottom of the box body is connected with an electronic component placing frame, the bottom of the box body is provided with a suction hole, one side of the box body is communicated with the vacuum tube, and the other side of the box body is communicated with the vacuum tube. An external vacuum pipeline and an electromagnetic valve are connected with a vacuum pipe to control, adsorb and fix the electronic component; the telescopic end of the hydraulic rod is connected with the top of the box body; and the solder paste smearing mechanism comprises a U-shaped plate and a limiting sliding block, and the limiting sliding block is located at the bottom of the electronic component containing frame. According to the automatic surface mounting equipment for the electronic components, the electr |
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