Manufacturing method of high-density through hole carrier plate solder mask gas guide plate

The invention discloses a manufacturing method of a high-density through hole carrier plate solder mask gas guide plate, and the method specifically comprises the steps: optimizing a plate fishing program, adding positioning PIN holes, fixing the gas guide plate, and guaranteeing the precise positioning of the gas guide plate; modifying a manufacturing mode of a plate fishing path, and reducing the path; the diameter of the fishing needle is optimized, so that the working efficiency is improved; according to the method, the manufacturing period can be effectively shortened, the yield verification can be greatly improved, the yield ratio of 100% can be achieved, the cost does not need to be additionally increased, and the expected productivity and quality can be achieved by using an existing standard Tefu forming machine (the price is about 150 thousand). 本发明公开了一种高密度通孔载板阻焊导气板的制作方法，具体为：捞板程式优化，增加定位PIN孔，起到固定导气板的作用，进而确保导气板的定位精准；修改捞板路径的制作方式，减少路径；捞针直径的优化，提高作业时效；本发明能够有效缩短制作周期，能够大大提高良率验证，能够达到100%的良品比例，不需要额外增加成本，使用现有的标