Rapid manufacturing method of substrate-free light source
The invention discloses a rapid manufacturing method of a substrate-free light source, which comprises the following steps of: arranging blue light flip chips with consistent luminous intensity and wavelength according to a designed interval array in advance, then filling white silica gel in gaps am...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a rapid manufacturing method of a substrate-free light source, which comprises the following steps of: arranging blue light flip chips with consistent luminous intensity and wavelength according to a designed interval array in advance, then filling white silica gel in gaps among the blue light flip chips, and baking and curing in an oven; and after curing, grinding white silica gel to a height equal to that of the blue light flip chip by using a grinding machine, then pasting a fluorescent film on the white silica gel by using an adhesive, baking and curing, and finally cutting the array flip chip pasted with the fluorescent film along the middle position of the gap to form an independent light emitting diode packaging body. A substrate and a welding wire are abandoned, the positive pole and the negative pole of the flip chip serve as bonding pads, fluorescent powder is directly attached to the flip chip to form a new light-emitting diode packaging body, production efficiency is improv |
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