LED chip mass transfer method and device

The invention provides an LED chip mass transfer method and device which are applied to an adhesive plate and a PCB substrate, the adhesive plate is provided with a plurality of LED chips, and the PCB substrate is provided with a plurality of bonding pads corresponding to the LED chips in a one-to-o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DING HONGQIANG, LAI LONGKUAN, LI JIAN, KE FUYAO, HU SHANSHAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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