LED chip mass transfer method and device

The invention provides an LED chip mass transfer method and device which are applied to an adhesive plate and a PCB substrate, the adhesive plate is provided with a plurality of LED chips, and the PCB substrate is provided with a plurality of bonding pads corresponding to the LED chips in a one-to-one mode. The LED chip mass transfer method comprises the following steps: driving an adhesive plate to be close to a PCB substrate, and attaching a plurality of LED chips to a plurality of bonding pads in a one-to-one correspondence manner; all the LED chips are welded on the corresponding bonding pads; and driving the adhesive plate to be far away from the PCB substrate, and stripping the adhesive plate from the LED chip. According to the technical scheme, the LED chips are fixed on the adhesive plate, before the LED chips and the bonding pads are welded in an aligned mode, the adhesive plate is close to the PCB substrate, so that all the LED chips can be tightly attached to the corresponding bonding pads, it is g