Chip packaging method and chip packaging structure

The invention provides a chip packaging method and a chip packaging structure, and relates to the field of semiconductor packaging. The chip packaging method is used for packaging a wafer and a substrate, one surface of the wafer is provided with a plurality of conductive bulge structures, one surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG LEI, PENG YU, CHEN ZHUANLING, PAN GUOTING, DAI YIYUAN, SHI YAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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