Device for improving silver plating uniformity of small micropores

The invention provides a device for improving silver plating uniformity of small micropores, and relates to the technical field of silver plating of the small micropores. The device comprises an electroplating bath, a driving frame and a sliding block, electroplating liquid is contained in the elect...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LI ZHIJUN, LI SHENGPENG, HU MENGYUAN, ZHANG HUI, CHEN GAIQING, ZHOU MINGZHI, FU REN, TIAN YE, LIU YING, ZUO FANGZHEN, XU CHUNTING, WU YING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a device for improving silver plating uniformity of small micropores, and relates to the technical field of silver plating of the small micropores. The device comprises an electroplating bath, a driving frame and a sliding block, electroplating liquid is contained in the electroplating bath; the horn antenna is clamped by the sliding block; the driving frame drives the sliding block to lift in the electroplating bath to drive the horn antenna to be separated from and immersed in the electroplating liquid; the sliding block is provided with a pipe joint and a plurality of first nozzles, the first nozzles are communicated with the tail end of a liquid suction pipe through the pipe joint, a liquid suction pump is arranged in the middle section of the liquid suction pipe, and the head end of the liquid suction pipe is inserted into electroplating liquid of the electroplating bath; the first nozzles and the small micropores of the horn antenna are arranged in a one-to-one correspondence mode