Material moving device of wafer cutting machine

The invention relates to the technical field of wafer cutting machines, in particular to a material moving device of a wafer cutting machine. The device comprises a moving device mounting plate, a first horizontal lead screw and a second horizontal lead screw which are parallel to each other are arranged on the moving device mounting plate up and down, the first horizontal lead screw is sleeved with a first horizontal seat, the second horizontal lead screw is sleeved with a second horizontal seat, and a first moving arm capable of moving up and down is vertically arranged on the first horizontal seat; a second moving arm capable of moving up and down is vertically arranged on the second horizontal seat, and the first moving arm and the second moving arm are staggered; according to the invention, the first moving arm and the second moving arm are staggered, and the first moving arm and the second moving arm can move horizontally and vertically, so that the wafer moving efficiency is greatly improved. 本发明涉及晶圆切割