Resin composition

The resin composition (10) according to the present application comprises a water-insoluble resin and a water-soluble substance, and slowly releases the water-soluble substance to the outside. The resin composition (10) is covered with a skin layer (11) containing a water-insoluble resin. 本申请所述的树脂组合...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HIRAI CHIE, OHSHIRO SATOSHI, UNO KATSUHIKO, ITOGA TOMONORI, FURUTA TSUTOMU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The resin composition (10) according to the present application comprises a water-insoluble resin and a water-soluble substance, and slowly releases the water-soluble substance to the outside. The resin composition (10) is covered with a skin layer (11) containing a water-insoluble resin. 本申请所述的树脂组合物(10)由水不溶性树脂和水溶性物质构成,且向外部缓慢释放水溶性物质。树脂组合物(10)被包含水不溶性树脂的表皮层(11)覆盖。