LASER PROCESSING APPARATUS AND METHOD FOR CONTROLLING LASER PROCESSING APPARATUS

A laser processing device (2) is provided with: an irradiation unit (240); a receiving unit (216) that receives the processing pattern and the irradiation condition of the laser beam (W); and a control unit (211) that controls the irradiation of the laser beam (W) on the basis of the processing patt...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIMITSU ASHIHARA, DODO KAZUMI, SAKAMOTO TATSUNORI, YOKOI TADAMASA, YOSHITAKE NAOKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing device (2) is provided with: an irradiation unit (240); a receiving unit (216) that receives the processing pattern and the irradiation condition of the laser beam (W); and a control unit (211) that controls the irradiation of the laser beam (W) on the basis of the processing pattern and the irradiation condition received by the reception unit (216). The control unit (211) performs a first process in which at least a part of a first processing region (P) of the object to be processed (8) is processed into an inverted pattern in which a laser beam (W) irradiation region and a laser beam (W) non-irradiation region of the processing pattern are inverted. 激光加工装置(2)具有：照射部(240)；受理部(216)，其受理加工图案和激光(W)的照射条件；以及控制部(211)，其基于由受理部(216)受理的加工图案和照射条件，控制激光(W)的照射。控制部(211)进行将加工对象物(8)的第1加工区域(P)的至少一部分加工成反转图案的第1处理，所述反转图案是使加工图案的激光(W)的照射区域和激光(W)的非照射区域进行反转而得到的。