Via coupling structures for reducing crosstalk effects
The invention relates to a via coupling structure for reducing crosstalk effects. In one embodiment, an apparatus includes first and second via structures in a substrate. Each via structure defines a coupling element extending from the via structure toward the other via structure such that the coupl...
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| creator | PADIJI SAURABH CHRISTIANSON SCOTT TORRES PINEDA EDUARDO DREW JASON |
| description | The invention relates to a via coupling structure for reducing crosstalk effects. In one embodiment, an apparatus includes first and second via structures in a substrate. Each via structure defines a coupling element extending from the via structure toward the other via structure such that the coupling elements are capacitively coupled to each other in a region between the first and second via structures.
本申请涉及用于减少串扰效应的通孔耦合结构。在一个实施例中，一种装置包括基板中的第一和第二通孔结构。每个通孔结构限定耦合元件，耦合元件从通孔结构朝向另一个通孔结构延伸，使得耦合元件在第一和第二通孔结构之间的区域中彼此电容耦合。 |
| format | Patent |
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本申请涉及用于减少串扰效应的通孔耦合结构。在一个实施例中，一种装置包括基板中的第一和第二通孔结构。每个通孔结构限定耦合元件，耦合元件从通孔结构朝向另一个通孔结构延伸，使得耦合元件在第一和第二通孔结构之间的区域中彼此电容耦合。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220930&DB=EPODOC&CC=CN&NR=115134997A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220930&DB=EPODOC&CC=CN&NR=115134997A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PADIJI SAURABH</creatorcontrib><creatorcontrib>CHRISTIANSON SCOTT</creatorcontrib><creatorcontrib>TORRES PINEDA EDUARDO</creatorcontrib><creatorcontrib>DREW JASON</creatorcontrib><title>Via coupling structures for reducing crosstalk effects</title><description>The invention relates to a via coupling structure for reducing crosstalk effects. In one embodiment, an apparatus includes first and second via structures in a substrate. Each via structure defines a coupling element extending from the via structure toward the other via structure such that the coupling elements are capacitively coupled to each other in a region between the first and second via structures.
本申请涉及用于减少串扰效应的通孔耦合结构。在一个实施例中，一种装置包括基板中的第一和第二通孔结构。每个通孔结构限定耦合元件，耦合元件从通孔结构朝向另一个通孔结构延伸，使得耦合元件在第一和第二通孔结构之间的区域中彼此电容耦合。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDALy0xUSM4vLcjJzEtXKC4pKk0uKS1KLVZIyy9SKEpNKU0GiScX5RcXlyTmZCukpqWlJpcU8zCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_Q0NTQ2MTS0tzR2Ni1AAA2FAuIA</recordid><startdate>20220930</startdate><enddate>20220930</enddate><creator>PADIJI SAURABH</creator><creator>CHRISTIANSON SCOTT</creator><creator>TORRES PINEDA EDUARDO</creator><creator>DREW JASON</creator><scope>EVB</scope></search><sort><creationdate>20220930</creationdate><title>Via coupling structures for reducing crosstalk effects</title><author>PADIJI SAURABH ; CHRISTIANSON SCOTT ; TORRES PINEDA EDUARDO ; DREW JASON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115134997A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>PADIJI SAURABH</creatorcontrib><creatorcontrib>CHRISTIANSON SCOTT</creatorcontrib><creatorcontrib>TORRES PINEDA EDUARDO</creatorcontrib><creatorcontrib>DREW JASON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PADIJI SAURABH</au><au>CHRISTIANSON SCOTT</au><au>TORRES PINEDA EDUARDO</au><au>DREW JASON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Via coupling structures for reducing crosstalk effects</title><date>2022-09-30</date><risdate>2022</risdate><abstract>The invention relates to a via coupling structure for reducing crosstalk effects. In one embodiment, an apparatus includes first and second via structures in a substrate. Each via structure defines a coupling element extending from the via structure toward the other via structure such that the coupling elements are capacitively coupled to each other in a region between the first and second via structures.
本申请涉及用于减少串扰效应的通孔耦合结构。在一个实施例中，一种装置包括基板中的第一和第二通孔结构。每个通孔结构限定耦合元件，耦合元件从通孔结构朝向另一个通孔结构延伸，使得耦合元件在第一和第二通孔结构之间的区域中彼此电容耦合。</abstract><oa>free_for_read</oa></addata></record> |
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| title | Via coupling structures for reducing crosstalk effects |
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