Via coupling structures for reducing crosstalk effects

The invention relates to a via coupling structure for reducing crosstalk effects. In one embodiment, an apparatus includes first and second via structures in a substrate. Each via structure defines a coupling element extending from the via structure toward the other via structure such that the coupling elements are capacitively coupled to each other in a region between the first and second via structures. 本申请涉及用于减少串扰效应的通孔耦合结构。在一个实施例中，一种装置包括基板中的第一和第二通孔结构。每个通孔结构限定耦合元件，耦合元件从通孔结构朝向另一个通孔结构延伸，使得耦合元件在第一和第二通孔结构之间的区域中彼此电容耦合。