Antenna device

The antenna is arranged on the substrate (21) as a part of the conductor (22). The antenna comprises a main board (31) for providing grounding potential; and a patch portion (32) disposed so as to face the main board in the Z direction. The substrate has a non-arrangement region (25) in which the co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE JUNG-EON, HAYASE YOICHI, MATSUMOTO SHOU, ATSUTA TAKASHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The antenna is arranged on the substrate (21) as a part of the conductor (22). The antenna comprises a main board (31) for providing grounding potential; and a patch portion (32) disposed so as to face the main board in the Z direction. The substrate has a non-arrangement region (25) in which the conductor is not arranged, as a region between the periphery (24) and the main board in plan view. The metal support portion (412) of the housing (41) is in contact with the non-arrangement region on the bottom surface (20b) of the substrate. 天线作为导体(22)的一部分布置在基板(21)上。天线包括提供接地电位的主板(31);以及布置成在Z方向面向所述主板的贴片部(32)。基板具有其中不布置导体的非布置区(25),作为在平面图中外围(24)与主板之间的区域。壳体(41)的金属支撑部(412)在基板的底表面(20b)上与非布置区接触。