Wafer processing method and device and storage medium

The invention discloses a wafer processing method. The wafer processing method comprises the following steps: dividing a to-be-processed area of a to-be-processed wafer into at least two processing sub-areas; determining a processing sequence and a processing direction corresponding to each processing sub-region; a wafer cutting device is controlled to sequentially perform cutting operation on the machining sub-areas according to the machining sequence; and after the cutting operation of the to-be-processed wafer is completed, controlling a wafer splitting device to sequentially perform splitting operation on each processing sub-region along the cutting lines according to the processing sequence. The invention further discloses wafer processing equipment and a storage medium. The wafer to be processed is divided into at least two processing sub-regions, the processing sequence and the processing direction corresponding to each processing sub-region are determined, and the processing of the wafer is completed