Method for manufacturing semiconductor device

Provided is a method for manufacturing a semiconductor device in which, when a semiconductor chip is transferred onto a terminal part of a wired circuit board provided with a wiring part, the connection between the semiconductor chip and the terminal part is stable. This method for manufacturing a s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHISHIDO, YUICHIRO, TANAKA YUKIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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