Method for manufacturing semiconductor device

Provided is a method for manufacturing a semiconductor device in which, when a semiconductor chip is transferred onto a terminal part of a wired circuit board provided with a wiring part, the connection between the semiconductor chip and the terminal part is stable. This method for manufacturing a semiconductor device is provided with: a transfer step for transferring a plurality of semiconductor chips (23) from a temporary fixing material (2) on which the semiconductor chips (23) are arranged onto a terminal part (12) of a mounting substrate (1) in which a resin layer (13) for fixing the semiconductor chips is formed on the terminal part (12) of a wiring circuit board (11) having a wiring part and the terminal part (12); and a connection step for electrically connecting the terminal part (12) and the semiconductor chip (23) by applying pressure from the semiconductor chip (23) side moved onto the mounting substrate (1). 本发明提供半导体装置的制造方法，所述制造方法在将半导体芯片转印至设置有布线部的布线电路基板的端子部上时，半导体芯片与端子部的连接稳定。本发明的半导体装置的制造方法具备：移设工序，