Integrated circuit and manufacturing method thereof

An integrated circuit and a method of manufacturing the same. The integrated circuit includes a device, a first interconnect structure disposed over the device, and a second interconnect structure positioned under the device. The first interconnect structure includes a plurality of front side metal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GAO ZHANGRUI, YANG GUONAN, CHEN SHENGXIONG, LIU YIQUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!