Semiconductor device

The embodiment provides a semiconductor device capable of expanding the application range of the land pattern size of a mountable substrate. According to one embodiment, a semiconductor device includes: a die pad on which a semiconductor chip is disposed; an electrode disposed away from the die pad; and a resin member covering the semiconductor chip, a portion of the die pad, and a portion of the electrode. The die pad has a first lower surface facing the semiconductor chip and having at least four first sides. A side of the resin member located in the same plane as the first lower surface is not parallel to the first side. The electrode has a second lower surface exposed from the resin member in the same plane as the first lower surface, and a side of the second lower surface facing the first side of the die pad is not parallel to the first side. 实施方式提供一种能够扩大可安装的基板的连接盘图案尺寸的应用范围的半导体装置。实施方式的半导体装置具备：裸片焊盘，配置有半导体芯片；电极，与上述裸片焊盘离开而配置；以及树脂部件，将上述半导体芯片、上述裸片焊盘的一部分及上述电极的一部分覆盖。上述裸片焊盘具有与上述半导体芯片对置且至少具有4个第1边的第1下表面。与上述第1下表面位于