Multi-layer composite ceramic plate and method for leading out conducting layer of multi-layer composite ceramic plate
The embodiment of the invention provides a multi-layer composite ceramic plate and a method for leading out a conducting layer of the multi-layer composite ceramic plate. The multi-layer composite ceramic plate comprises a ceramic substrate and a conductive layer wrapped in the ceramic substrate. Th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention provides a multi-layer composite ceramic plate and a method for leading out a conducting layer of the multi-layer composite ceramic plate. The multi-layer composite ceramic plate comprises a ceramic substrate and a conductive layer wrapped in the ceramic substrate. The method comprises the following steps of: forming a counter bore on the ceramic substrate, wherein the counter bore is used for partially exposing the conducting layer; a conducting layer leading-out layer is formed on the inner wall of the counter bore and the exposed part of the conducting layer, the conducting layer leading-out layer contains active metal components, and the conducting layer leading-out layer is electrically connected with the conducting layer; and solder is added into the counter bore for heating and welding, so that an external electric connector of the conducting layer of the multi-layer composite ceramic disc is formed in the counter bore. The active sealing process is adopted for welding, |
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