Novel low-leakage voltage stabilizing diode packaging method

The invention discloses a novel low-leakage voltage-stabilizing diode packaging method, relates to the field of diode packaging, and solves the problem that a large number of tiny bubbles exist in glue liquid during existing glue dripping packaging. The novel low-leakage voltage-stabilizing diode packaging method comprises the following steps that the glue liquid is dripped into a forming groove of a lower mold of a combined packaging module through a first glue dispenser; a diode chip is placed in the forming groove through manual work or discharging equipment, the driving assembly can be triggered in the covering process of the upper forming plate and the lower forming plate, the airtight rod of the driving assembly rapidly moves upwards and downwards under the action of the rigid tension spring, and the piston disc can be rapidly pushed in; the suction pipe can suck air between the upper forming plate and the lower forming plate through the suction pipe, and the suction speed is far greater than the speed