Numerical simulation method for crack propagation of multi-interface non-uniform material under strong transient thermal load

The invention belongs to the technical field of transient thermal fracture of a non-uniform material, and discloses a numerical simulation method for crack propagation of a multi-interface non-uniform material under a strong transient thermal load, which comprises the following steps of: establishin...

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Bibliographische Detailangaben
Hauptverfasser: YE TI, ZHANG YANYAN, GUO FENGNAN, ZHOU BIN, FENG SHILIN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention belongs to the technical field of transient thermal fracture of a non-uniform material, and discloses a numerical simulation method for crack propagation of a multi-interface non-uniform material under a strong transient thermal load, which comprises the following steps of: establishing a numerical model of the non-uniform material containing cracks in Matlab, setting thermodynamic parameters of the material, obtaining a transient temperature field based on a linear acceleration principle, and calculating the crack propagation of the multi-interface non-uniform material under the strong transient thermal load. And extracting a transient stress intensity factor of the inner crack tip of the multi-interface non-uniform material through transient interaction integral. And crack propagation key parameters in the non-uniform material are obtained based on the fracture theory. The numerical simulation method for crack propagation of the multi-interface non-uniform material under the transient thermal