Porous polyurethane polishing pad and preparation method thereof

The embodiment of the invention relates to a porous polyurethane polishing pad for semi-chemical mechanical planarization and a preparation method thereof. Thermal expansion microcapsules and inert gas are used as gas phase foaming agents, the size and distribution of holes in the porous polyurethan...

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Bibliographische Detailangaben
Hauptverfasser:	SEO JANG-WON, HEO HYE YOUNG, HAN HYUK HEE, RYOU JOON-SUNG, KWON YOUNG-PIL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL PROCESSES OF COMPOUNDING GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POLISHING THEIR PREPARATION OR CHEMICAL WORKING-UP TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The embodiment of the invention relates to a porous polyurethane polishing pad for semi-chemical mechanical planarization and a preparation method thereof. Thermal expansion microcapsules and inert gas are used as gas phase foaming agents, the size and distribution of holes in the porous polyurethane polishing pad can be controlled, and therefore the polishing performance of the porous polyurethane polishing pad can be adjusted. 本发明实施方式涉及一种用于半化学机械平坦化的多孔聚氨酯抛光垫及其制备方法。通过热膨胀微胶囊和惰性气体作为气相发泡剂，可以控制多孔聚氨酯抛光垫中孔的尺寸和分布，从而可以调节其抛光性能。