Spraying system for establishing gradient structure etching and control device for controlling particles
The invention discloses a spraying system for establishing gradient structure etching and a control device for particle control, and relates to the technical field of single wafer cleaning, the spraying system comprises a mounting plate, a shell, an atomization spraying mechanism, a spot spraying me...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a spraying system for establishing gradient structure etching and a control device for particle control, and relates to the technical field of single wafer cleaning, the spraying system comprises a mounting plate, a shell, an atomization spraying mechanism, a spot spraying mechanism, a direct spraying mechanism and a wafer bearing platform assembly, the shell is arranged on the mounting plate, and the shell is arranged on the mounting plate; a cleaning cavity is formed in the shell, the wafer bearing platform assembly is arranged in the cleaning cavity, and the atomization spraying mechanism, the spot spraying mechanism and the direct spraying mechanism are arranged on the portion, located on the periphery of the shell, of the mounting plate. Direct spraying can be controlled, micro-amplitude swinging can be generated, spot spraying can be performed on the outer edge of a crystal, atomizing spraying can be performed on the crystal, so that the reaction is more uniform, and the use is m |
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