Photoelectric coupler packaging structure and packaging method thereof

The invention relates to the technical field of electronic packaging, in particular to a photoelectric coupler packaging structure and a packaging method thereof. The packaging structure comprises a ceramic base, a ceramic cover plate, a conductive adhesive, a photoelectric transistor, a bonding wire, a light-emitting diode and an insulating protective film, the bottom surface of the ceramic base is a leading-out end, the top surface of the ceramic base is provided with a first electric signal input end bonding pad of the light-emitting diode, and a first bonding area and a bonding finger are arranged in a core cavity of the ceramic base. The bonding pad I, the bonding area I and the bonding finger are respectively communicated with the leading-out end in the ceramic base; the photoelectric transistor is bonded on the bonding area I through a conductive adhesive, and is interconnected with the bonding finger through a bonding wire; the ceramic cover plate is single-layer single-side metallization, and a singl