Packaging structure and forming method thereof

A package structure and a method of forming the same are provided. The packaging structure comprises an adapter plate, and the adapter plate comprises an insulation structure, a conductive pad, a first wire and a first conductive channel structure. The insulation structure is provided with a first s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN MENGLIANG, ZHUANG BOYAO, ZHENG XINPU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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