Packaging structure and forming method thereof

A package structure and a method of forming the same are provided. The packaging structure comprises an adapter plate, and the adapter plate comprises an insulation structure, a conductive pad, a first wire and a first conductive channel structure. The insulation structure is provided with a first surface and a second surface opposite to the first surface, the conductive pad is located on the first surface, the first wire is located in the insulation structure and electrically connected with the conductive pad, and the first conductive channel structure is partially located in the insulation structure and connected with the first wire. The package structure includes an electronic component bonded to the conductive pad. The package structure includes a chip structure bonded to a first end portion of the first conductive channel structure. The package structure includes a first conductive bump connected between the chip structure and the first end portion of the first conductive channel structure. The first end