SEMICONDUCTOR PACKAGE

The embodiment of the invention provides a semiconductor packaging body. In one embodiment, a semiconductor package includes a first integrated circuit die having a first circuit design, and the first integrated circuit die includes a first device layer and a first interconnect structure. The semico...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI MINGHAN, HONG HANTANG, YANG SHIYI, SUI XIAOLIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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