SEMICONDUCTOR PACKAGE

The embodiment of the invention provides a semiconductor packaging body. In one embodiment, a semiconductor package includes a first integrated circuit die having a first circuit design, and the first integrated circuit die includes a first device layer and a first interconnect structure. The semiconductor package also includes a second integrated circuit die having a second circuit design different from the first circuit design, and the second integrated circuit die includes a second device layer and a second interconnect structure, the second interconnect structure has a first side in contact with the first device layer and a second side in direct contact with the first interconnect structure of the first integrated circuit die. The semiconductor package further includes a substrate having a first side bonded to the first interconnect structure, with the second integrated circuit die surrounded by at least a portion of the substrate. 本公开实施例提供一种半导体封装体。在一个实施例中，半导体封装包括具有第一电路设计的第一集成电路晶粒，且第一集成电路晶粒包括第一装置层和第一内连线结构