Vinyl MQ resin bonding detection system and working method
The invention discloses a vinyl MQ resin bonding detection system in the technical field of resin bonding strength test devices, which comprises a test base, a fixed plate, a movable plate, a connecting unit, a first detection rod, a second detection rod, a swing arm, an arc-shaped seat, a forming s...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a vinyl MQ resin bonding detection system in the technical field of resin bonding strength test devices, which comprises a test base, a fixed plate, a movable plate, a connecting unit, a first detection rod, a second detection rod, a swing arm, an arc-shaped seat, a forming space, a storage cavity, an injection port, a push plate, a horizontal push unit and a test unit, the two swing arms are driven by the driving unit to turn over along the hinged position with the first detection rod. Resin is injected into the material storage cavity, then the horizontal pushing unit drives the resin to be extruded into the forming space, bubbles are discharged from the main injection port in the extrusion process, in this way, generation of the bubbles is reduced, then the testing unit drives the movable plate to move, the bonding strength of the vinyl MQ resin can be detected, and in addition, the connecting unit is arranged, so that the bonding strength of the vinyl MQ resin can be detected. Ther |
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