Adhesive glue with high thermal conductivity and low specific gravity and preparation method thereof

The invention provides an adhesive with high thermal conductivity and low specific gravity. The adhesive is prepared from the following components in parts by weight: 100 parts of alkoxy-terminated polysiloxane, 20 to 40 parts of methyltrimethoxysiloxane, 100 to 150 parts of heat-conducting filler, 10 to 30 parts of modified heat-conducting filler, 20 to 50 parts of flame-retardant filler, 1 to 2 parts of catalyst, 0.1 to 1 part of coupling agent and 0.5 to 1 part of cross-linking agent. The adhesive provided by the invention has the advantages of high thermal conductivity and low specific gravity. 本发明提供了一种高导热低比重粘接胶，其包括如下重量份数的组分：100份烷氧基封端聚硅氧烷，20-40份甲基三甲氧基硅氧烷，100-150份的导热填料，10-30份的改性导热填料，20-50份的阻燃填料，1-2份的催化剂，0.1-1份的偶联剂，0.5-1份交联剂。本发明的粘接胶具有高导热低比重粘接胶的优点。