Bottom filling material with good compatibility with soldering flux

The invention relates to an underfill material with good compatibility with a soldering flux. The underfill material is prepared from the following raw materials: 11-20 parts of aminophenyl trifunctional epoxy resin, 25-32 parts of diphenol methane epoxy resin, 10-13 parts of a toughening agent, 0.5-1 part of a silane coupling agent, 29-33 parts of filler and 8-15 parts of a curing agent. The bottom filling material has the advantages of being good in compatibility with scaling powder in solder balls, small in thermal expansion coefficient, good in temperature resistance and humidity resistance and the like, has obvious advantages compared with a traditional bottom filling material, and enables a chip packaging assembly to have higher reliability. 本发明涉及一种与助焊剂兼容性良好的底部填充材料，所述底部填充材料由以下各原料组成：氨酚基三官能团型环氧树脂11～20份、二酚基甲烷型环氧树脂25～32份、增韧剂10～13份、硅烷偶联剂0.5～1份、填料29～33份、固化剂8～15份。本发明的底部填充材料具有与焊锡球中助焊剂兼容性良好,热膨胀系数小，耐温耐湿性良好等优点，相较于传统的底部填充材料具有明显的优势，使芯片封装组件具有更高的可靠性。