Kit and manufacturing process thereof

The invention relates to kit processing, in particular to a kit and a manufacturing process thereof, and the process comprises the following steps: step 1, placing a plate between a forming die and a stamping die for stamping; secondly, cutting the two sides of the plate through a cutting tool to fo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: HAN ZHONGBIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to kit processing, in particular to a kit and a manufacturing process thereof, and the process comprises the following steps: step 1, placing a plate between a forming die and a stamping die for stamping; secondly, cutting the two sides of the plate through a cutting tool to form a plurality of inclined protrusions; thirdly, bending the side edges of the plate through cooperation of a bending mold and a heating rod to form side plates, and machining the plate to form a containing module; and step 4, placing the placing module in the kit body, enabling the two side plates to abut against the side walls in the kit body, and positioning the height of the placing module, the kit comprises the kit body and the placing module placed in the kit body, the side plates are arranged on the side edges of the placing module, a plurality of inclined protrusions are arranged on the side plates, and the inclined protrusions are arranged on the side plates. The inclined protrusions make contact with the