Wafer corner defect inspection device and inspection method

The present invention relates to a wafer corner defect inspection device and an inspection method capable of accurately inspecting corner defects of a wafer, and specifically, the wafer corner defect inspection device comprises a plate-shaped wafer, a clamping part for fixing the wafer, and an edge...

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Bibliographische Detailangaben
1. Verfasser:	MIN KYOUNG-HOON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The present invention relates to a wafer corner defect inspection device and an inspection method capable of accurately inspecting corner defects of a wafer, and specifically, the wafer corner defect inspection device comprises a plate-shaped wafer, a clamping part for fixing the wafer, and an edge detection part for detecting the corner defects of the wafer. 本发明涉及一种能够准确地检查晶片的棱角缺陷的晶片棱角缺陷检查装置和检查方法，具体地，包括：板材形状的晶片，固定晶片的夹持部以及检测晶片棱角的缺陷的边缘检测部。