Elastic wave device, method for manufacturing same, and module including elastic wave device
An elastic wave device includes: a wiring substrate; the first device chip is electrically connected to the wiring substrate through a first conductive component; the second device chip is electrically connected to the wiring substrate through a second conductive component; a height of the second co...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | An elastic wave device includes: a wiring substrate; the first device chip is electrically connected to the wiring substrate through a first conductive component; the second device chip is electrically connected to the wiring substrate through a second conductive component; a height of the second conductive component is greater than a height of a stack of the first conductive component and the first device chip. Therefore, the installation area of the elastic wave device can be reduced.
一种弹性波装置,包含:布线基板;第一装置芯片,通过第一导电组件电性连接于所述布线基板;第二装置芯片,通过第二导电组件电性连接于所述布线基板;所述第二导电组件的高度高于所述第一导电组件与所述第一装置芯片的堆叠的高度。借此,能缩小弹性波装置的安装面积。 |
---|