Manufacturing method of substrate
The invention discloses a method for manufacturing a substrate, which comprises the following steps of: forming a conductive metal layer on the surface of a transparent base material, carrying out oil removal and micro-etching treatment on the conductive metal layer by adopting an oil removal agent,...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for manufacturing a substrate, which comprises the following steps of: forming a conductive metal layer on the surface of a transparent base material, carrying out oil removal and micro-etching treatment on the conductive metal layer by adopting an oil removal agent, and finally depositing a tin layer on the surface of the conductive metal layer, so that the tin layer covers the surface of the conductive metal layer, thereby achieving the effect of protecting the conductive metal layer. Meanwhile, the degreasing agent comprises Cu < 2 + > ions with the concentration smaller than 2 g/L, the surface of the conductive metal layer can be slightly eroded so as to remove dirt on the surface of the conductive metal layer, and the adhesive force and the binding force of the tin layer and the conductive metal layer are improved. Therefore, by means of the manufacturing method of the substrate, a reliable protection layer can be formed on the surface of the substrate, the substrate is p |
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