Interface failure evaluation method considering shear stress reverse phenomenon and data discreteness
The invention discloses an interface failure evaluation method considering a shear stress reverse phenomenon and data discreteness. A fluctuation distribution function is introduced into a typical interface slip function, a bond-slip analysis model capable of simultaneously reflecting an interface s...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an interface failure evaluation method considering a shear stress reverse phenomenon and data discreteness. A fluctuation distribution function is introduced into a typical interface slip function, a bond-slip analysis model capable of simultaneously reflecting an interface shear stress reverse phenomenon and bond-slip curve discreteness is theoretically derived, the model is verified by adopting experimental data of different scholars, and a corresponding interface stripping failure evaluation method is established. According to the evaluation method for the interface peeling failure disclosed by the invention, the adhesion-slip model does not need to introduce additional empirical parameters, the physical significance is clear, discreteness of the adhesion-slip curve and a shear stress reverse phenomenon both originate from interface microcracks can be explained, and the peeling failure mechanism of the interface is further clarified.
本发明公开了一种考虑剪应力反向现象及数据离散性的界面破坏评价方法。在典型的界面滑移函数中引入波动分 |
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