Evaporation equipment and application method thereof
The embodiment of the invention discloses evaporation equipment and an application method thereof, the evaporation equipment comprises an evaporation cavity, and an evaporation base table and an evaporation source are arranged in the evaporation cavity; the evaporation base station is used for fixin...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention discloses evaporation equipment and an application method thereof, the evaporation equipment comprises an evaporation cavity, and an evaporation base table and an evaporation source are arranged in the evaporation cavity; the evaporation base station is used for fixing a substrate to be evaporated; the evaporation source comprises at least two evaporation units, each evaporation unit comprises a nozzle, and the evaporation units form a plating layer on the surface of the substrate to be evaporated through the nozzles in the evaporation process; wherein in the evaporation process, the distance between at least one evaporation unit and the evaporation base table is larger than the distance between other evaporation units and the evaporation base table. The evaporation equipment and the application method thereof have the beneficial effects that the evaporation source of the doped material is moved during evaporation, so that the evaporation source is gradually away from the to-be |
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