Silicon rod cutting equipment
The embodiment of the invention provides silicon rod cutting equipment. The silicon rod cutting equipment comprises a machine base; the silicon rod bearing device is arranged on the machine base; the linear cutting device is arranged on the machine base; the wire cutting device and the silicon rod b...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention provides silicon rod cutting equipment. The silicon rod cutting equipment comprises a machine base; the silicon rod bearing device is arranged on the machine base; the linear cutting device is arranged on the machine base; the wire cutting device and the silicon rod bearing device can move relatively; in the relative movement process, the silicon rod is cut by a cutting wire wound on the wire cutting device; the centering device is arranged on the silicon rod bearing device, and at least one pair of centering clamping jaws in the centering device extends to the two sides of the silicon rod and is used for pushing the silicon rod to move to a target cutting position corresponding to the cutting line. According to the silicon rod cutting equipment provided by the embodiment of the invention, the silicon rod can be centered, and then the silicon rod is cut into small silicon rods with small cross sectional areas through the cutting lines.
本申请实施例提供一种硅棒切割设备,包括:机座;硅棒承载装置,设置于所述机座上;线切割 |
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