Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage

确定晶片翘曲以便随后在静电吸盘上处理晶片时将其供给静电吸盘的方法和装置。该装置有静电吸盘和控制装置。静电吸盘有吸持表面，由吸持力吸持晶片，吸持力取决加给静电吸盘的箝位电压。控制装置在晶片处理前检测晶片的固有翘曲，以测量的翘曲确定最小箝位电压在晶片随后处理期间加给静电吸盘。各晶片最小箝位电压值使晶片吸持于吸持表面。控制装置有晶片翘曲测量仪和用测量的翘曲确定随后各晶片处理中用于各晶片的最小箝位电压和有关晶片识别数据并存储在存储器中静电吸盘软件控制器。 The apparatus includes a single bipolar electrostatic chuck (12) with a cl...

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Bibliographische Detailangaben
Hauptverfasser:	DARRYL RESTAINO, MARK HOINKIS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CONVEYING ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MANIPULATORS PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Zusammenfassung:	确定晶片翘曲以便随后在静电吸盘上处理晶片时将其供给静电吸盘的方法和装置。该装置有静电吸盘和控制装置。静电吸盘有吸持表面，由吸持力吸持晶片，吸持力取决加给静电吸盘的箝位电压。控制装置在晶片处理前检测晶片的固有翘曲，以测量的翘曲确定最小箝位电压在晶片随后处理期间加给静电吸盘。各晶片最小箝位电压值使晶片吸持于吸持表面。控制装置有晶片翘曲测量仪和用测量的翘曲确定随后各晶片处理中用于各晶片的最小箝位电压和有关晶片识别数据并存储在存储器中静电吸盘软件控制器。 The apparatus includes a single bipolar electrostatic chuck (12) with a clamping surface for clamping to a wafer (14) by a force dependent on a clamping voltage applied to the chuck when the wafer is processed. A control arrangement (16,18,20) measures inherent warpage in the wafer prior to the wafer being processed on the chuck. The warpage is used to determine a minimum clamping voltage to be applied to the chuck during wafer processing.