Epoxy resin

The name of the invention is epoxy resin. The present disclosure relates to epoxide-containing compounds comprising three benzene units linked by a bridging group. The present disclosure also relates to the production of curable epoxy resin formulations comprising the epoxide-containing compounds, a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VARLEY RICHARD JOHN, TUCKER STEPHEN, TIAN WENJUN W, DAO NGUYEN BUU, WAGERS JEFFREY, KRISTINSSON, STEFAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The name of the invention is epoxy resin. The present disclosure relates to epoxide-containing compounds comprising three benzene units linked by a bridging group. The present disclosure also relates to the production of curable epoxy resin formulations comprising the epoxide-containing compounds, as well as the possible incorporation thereof in composite materials, such as fiber-reinforced composite materials. Also disclosed are possible methods of formulating compounds including epoxide-containing compounds as described herein. 本发明的名称是环氧树脂。本公开涉及含环氧化物的化合物,其包括由桥连基团连接的三个苯单元。本公开还涉及包括所述含环氧化物的化合物的可固化环氧树脂制剂的生产,以及其在复合材料诸如纤维增强的复合材料中的可能的并入。还公开了配制如本文所描述的包括含环氧化物的化合物的可能的方法。