Leading-out wire assembly processing device and processing method thereof
According to the lead-out wire assembly processing device and the processing method thereof, a lead-out wire is placed into a main wire duct according to the cooperation of a lead-out wire terminal and a terminal jack, placement is convenient, the placement sequence can be determined through a limit...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | According to the lead-out wire assembly processing device and the processing method thereof, a lead-out wire is placed into a main wire duct according to the cooperation of a lead-out wire terminal and a terminal jack, placement is convenient, the placement sequence can be determined through a limiting groove, and it is guaranteed that the lead-out wire can be correctly placed into the main wire duct; after the lead-out wires are put in, the lead-out wires are positioned through the positioning assembly, the position relation of the lead-out wires is kept, and injection molding is facilitated; a hot runner mechanism is arranged in the top seat to ensure the injection molding effect; the inclined ejection mechanism arranged in the ejection base can eject the mold base open after injection molding is completed, and the mold base and the cover body can be separated conveniently; and the ejection mechanism is arranged below the mold base, so that the injection-molded product can be automatically ejected out after |
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