IC card chip lead frame and production process thereof

The invention relates to the field of integrated circuit products, in particular to an IC (integrated circuit) card chip lead frame and a production process thereof, and solves the problem that the mechanical strength of the lead frame and a manufactured IC card is affected due to the fact that the number of etching channels of an existing lead frame is generally large. A plurality of plastic package grooves are formed between the outer frame and the fixed sheet, the plurality of plastic package grooves are arranged around the fixed sheet, the edges of the plurality of plastic package grooves are connected with a plurality of steps, and the thickness of the plurality of steps is smaller than the thickness of the fixed sheet and the outer frame. The lead frame has the effect of improving the mechanical strength of the lead frame. 本申请涉及集成电路产品的领域，尤其是一种IC卡芯片引线框架及其生产工艺，解决了现有的引线框架刻蚀通道普遍较多，影响了引线框架及制作成的IC卡的机械强度的问题，其包括外框架，所述外框架内连接有固定片，所述外框架和所述固定片间形成有多个塑封槽，多个所述塑封槽围绕所述固定片开设，多个所述塑封槽边缘连接有若干台阶，若干所述台阶的厚度小于所述固定片及所述外框架的厚度。本申请