Wafer thinning protective film and manufacturing method thereof

The invention provides a wafer thinning protective film which mainly comprises a base material layer and a polyurethane resin layer composition. Wherein the polyurethane resin layer composition at least comprises a high-temperature polyurethane resin layer and a low-temperature polyurethane resin layer. The wafer thinning protective film has the advantages of being good in wafer surface coating performance, easy to strip and the like. The method for manufacturing the wafer thinning protective film has the advantages of being low in cost, easy in process condition control and the like. 本发明提出一种晶圆减薄保护膜，主要包括一基材层及一聚氨酯树脂层组合物。其中聚氨酯树脂层组合物至少包括一高温聚氨酯树脂层及一低温聚氨酯树脂层。本发明的晶圆减薄保护膜具有晶圆表面包覆性佳、容易剥除等优点。本发明的制造晶圆减薄保护膜的方法具有成本较低、制程条件容易控制等优点。