Low-dielectric high-temperature-resistant resin-based composite material and preparation method thereof

The invention provides a low-dielectric high-temperature-resistant resin-based composite material and a preparation method thereof. The method comprises the following steps: carrying out a reaction on montmorillonite, polyphenyl silsesquioxane with an amino group and a fluorine-containing amino compound to obtain fluorinated polyphenyl silsesquioxane-montmorillonite; reacting the fluorinated polyphenyl silsesquioxane-montmorillonite with a polyimide diamine monomer and a polyimide dianhydride monomer in sequence to obtain a polyimide prepolymer; and carrying out imidization dehydration on the polyimide prepolymer to obtain the composite material. According to the invention, the polyimide composite material is prepared by modifying montmorillonite through fluoride and polyphenyl silsesquioxane, so that the dielectric property of polyimide is effectively reduced, and the heat resistance, mechanical property, flame retardance and other properties of polyimide are also greatly improved. 本发明提供了一种低介电耐高温树脂基复合材料及其制备方