Laser processing device and method for brittle material

The invention belongs to the technical field of laser processing, and relates to a laser processing device and method for a brittle material, which are used for processing a to-be-processed workpiece made of the brittle material, and the to-be-processed workpiece made of the brittle material compris...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: REN LINA, GAO YUNFENG, LU JIANGANG, SUN JIE, QIU YUEWEI, YIN JIANGANG, ZHANG XIAOJUN, HU HUI, LI YOUQIANG, YUAN XUERUI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the technical field of laser processing, and relates to a laser processing device and method for a brittle material, which are used for processing a to-be-processed workpiece made of the brittle material, and the to-be-processed workpiece made of the brittle material comprises a first layer and a second layer which are stacked; the laser processing device comprises a laser device, a light splitting part and a Bessel beam generating assembly which are arranged in sequence. The laser is used for emitting Gaussian beams; the light splitting part is used for splitting a Gaussian beam emitted from the laser to obtain a first beam transmitted along a first direction and a second beam transmitted along a second direction; the Bessel beam generation assembly is used for converting the first light beam emitted from the light splitting part into a first light beam in Bessel distribution, and the first light beam is used for processing a first layer; and the second light beam is used for process