Single lead frame separating device
The invention discloses a single lead frame separating device, and relates to the technical field of integrated circuits. The problems that single power devices arranged in a lead frame after plastic packaging cannot be separated at will, products are arranged in a scattered mode after rib cutting f...
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| creator | DU HONGWEI DING QI LIU XUCHANG |
| description | The invention discloses a single lead frame separating device, and relates to the technical field of integrated circuits. The problems that single power devices arranged in a lead frame after plastic packaging cannot be separated at will, products are arranged in a scattered mode after rib cutting forming and separation are adopted, and sampling data are inaccurate are solved. Comprising a pressing handle which is arranged on the manual punching machine and enables the manual punching machine to move downwards in the vertical direction through the pressing handle; the upper surface of the upper die frame is used for arranging the manual punching machine, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the upper die frame drives the male die to move downwards in the vertical direction under the action of the pressing handle; the lower die holder is located under the upper die frame, a female die plate comprising a female die is arranged on |
| format | Patent |
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The problems that single power devices arranged in a lead frame after plastic packaging cannot be separated at will, products are arranged in a scattered mode after rib cutting forming and separation are adopted, and sampling data are inaccurate are solved. Comprising a pressing handle which is arranged on the manual punching machine and enables the manual punching machine to move downwards in the vertical direction through the pressing handle; the upper surface of the upper die frame is used for arranging the manual punching machine, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the upper die frame drives the male die to move downwards in the vertical direction under the action of the pressing handle; the lower die holder is located under the upper die frame, a female die plate comprising a female die is arranged on</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; PERFORMING OPERATIONS ; PUNCHING METAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220913&DB=EPODOC&CC=CN&NR=115041580A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220913&DB=EPODOC&CC=CN&NR=115041580A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DU HONGWEI</creatorcontrib><creatorcontrib>DING QI</creatorcontrib><creatorcontrib>LIU XUCHANG</creatorcontrib><title>Single lead frame separating device</title><description>The invention discloses a single lead frame separating device, and relates to the technical field of integrated circuits. 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The problems that single power devices arranged in a lead frame after plastic packaging cannot be separated at will, products are arranged in a scattered mode after rib cutting forming and separation are adopted, and sampling data are inaccurate are solved. Comprising a pressing handle which is arranged on the manual punching machine and enables the manual punching machine to move downwards in the vertical direction through the pressing handle; the upper surface of the upper die frame is used for arranging the manual punching machine, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the upper die frame drives the male die to move downwards in the vertical direction under the action of the pressing handle; the lower die holder is located under the upper die frame, a female die plate comprising a female die is arranged on</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL SEMICONDUCTOR DEVICES TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL |
| title | Single lead frame separating device |
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